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Wayne Cantwell, Co-Founder and Managing Director at Decathlon Capital Partners

Wayne Cantwell

Co-Founder and Managing Director @ Decathlon Capital Partners

Park City, United States

Wayne Cantwell is a Series C investor at Decathlon Capital Partners in Park City focused on Consulting and Electronics. Wayne Cantwell is the Co-Founder & Managing Director of Decathlon Capital Partners. He attended DeVry Institute of Technology.

Total investments:
10
Last investment:
Lead investor:
50%

Last updated:

Industries Wayne Cantwell invests in

ConsultingElectronicsManufacturingSemiconductorIndustrial Design

Stages Wayne Cantwell invests in

Series CFunding RoundSeries BSeries DSeries E

Countries Wayne Cantwell invests in

United States

Investment Focus

Industry

  • Consulting 1 (10%)
  • Electronics 1 (10%)
  • Manufacturing 1 (10%)
  • Semiconductor 1 (10%)
  • Industrial Design 1 (10%)
See all 7 industries →

Stage

  • Series C 2 (20%)
  • Funding Round 2 (20%)
  • Series B 1 (10%)
  • Series D 1 (10%)
  • Series E 1 (10%)
See all 8 stages →

Investments

CompanyDescriptionRoundLinks
Talentism Talentism
Talentism is a strategic consulting firm that approaches key questions of business strategy and performance from a rigorous leadership perspective. Apr 16, 2023
Talentism Talentism
Talentism is a strategic consulting firm that approaches key questions of business strategy and performance from a rigorous leadership perspective. Debt Financing / Apr 16, 2023
eASIC eASIC
eASIC, a fabless semiconductor company, manufactures eASIC platforms that reduce the cost of ownership and time to production of customized silicon devices. It develops Nextreme family of devices that reduce development cost and turn-around times compared to standard cell ASICs, while reducing power consumption and unit cost for designs,Nextreme-3, a fourth generation eASIC platform, and Nextreme-2, a third generation eASIC platform. eASIC also provides easicopy ASIC that provides OEMs with a path from Nextreme-3, Nextreme-2, or Nextreme devices to a cell-based easicopy ASIC, which thereby helps OEMs reduce device cost and power consumption further, or increase performance, and eZ-IP alliance program to bring a wealth of verified eASIC-ready IP cores to help customers get to market faster. Its products are used in various applications that span from wireless infrastructure to consumer handheld devices. eASIC serves customers worldwide. Zvi Or-Bach founded eASIC in 1999, with its headquarters in Santa Clara in California with additional offices worldwide. $23.5M / Private Equity / Sep 11, 2013
eASIC eASIC
eASIC, a fabless semiconductor company, manufactures eASIC platforms that reduce the cost of ownership and time to production of customized silicon devices. It develops Nextreme family of devices that reduce development cost and turn-around times compared to standard cell ASICs, while reducing power consumption and unit cost for designs,Nextreme-3, a fourth generation eASIC platform, and Nextreme-2, a third generation eASIC platform. eASIC also provides easicopy ASIC that provides OEMs with a path from Nextreme-3, Nextreme-2, or Nextreme devices to a cell-based easicopy ASIC, which thereby helps OEMs reduce device cost and power consumption further, or increase performance, and eZ-IP alliance program to bring a wealth of verified eASIC-ready IP cores to help customers get to market faster. Its products are used in various applications that span from wireless infrastructure to consumer handheld devices. eASIC serves customers worldwide. Zvi Or-Bach founded eASIC in 1999, with its headquarters in Santa Clara in California with additional offices worldwide. Series E / Jun 14, 2010
eASIC eASIC
eASIC, a fabless semiconductor company, manufactures eASIC platforms that reduce the cost of ownership and time to production of customized silicon devices. It develops Nextreme family of devices that reduce development cost and turn-around times compared to standard cell ASICs, while reducing power consumption and unit cost for designs,Nextreme-3, a fourth generation eASIC platform, and Nextreme-2, a third generation eASIC platform. eASIC also provides easicopy ASIC that provides OEMs with a path from Nextreme-3, Nextreme-2, or Nextreme devices to a cell-based easicopy ASIC, which thereby helps OEMs reduce device cost and power consumption further, or increase performance, and eZ-IP alliance program to bring a wealth of verified eASIC-ready IP cores to help customers get to market faster. Its products are used in various applications that span from wireless infrastructure to consumer handheld devices. eASIC serves customers worldwide. Zvi Or-Bach founded eASIC in 1999, with its headquarters in Santa Clara in California with additional offices worldwide. $48M / Series D / Mar 13, 2008
eASIC eASIC
eASIC, a fabless semiconductor company, manufactures eASIC platforms that reduce the cost of ownership and time to production of customized silicon devices. It develops Nextreme family of devices that reduce development cost and turn-around times compared to standard cell ASICs, while reducing power consumption and unit cost for designs,Nextreme-3, a fourth generation eASIC platform, and Nextreme-2, a third generation eASIC platform. eASIC also provides easicopy ASIC that provides OEMs with a path from Nextreme-3, Nextreme-2, or Nextreme devices to a cell-based easicopy ASIC, which thereby helps OEMs reduce device cost and power consumption further, or increase performance, and eZ-IP alliance program to bring a wealth of verified eASIC-ready IP cores to help customers get to market faster. Its products are used in various applications that span from wireless infrastructure to consumer handheld devices. eASIC serves customers worldwide. Zvi Or-Bach founded eASIC in 1999, with its headquarters in Santa Clara in California with additional offices worldwide. $17M / Series C / Oct 06, 2005
eASIC eASIC
eASIC, a fabless semiconductor company, manufactures eASIC platforms that reduce the cost of ownership and time to production of customized silicon devices. It develops Nextreme family of devices that reduce development cost and turn-around times compared to standard cell ASICs, while reducing power consumption and unit cost for designs,Nextreme-3, a fourth generation eASIC platform, and Nextreme-2, a third generation eASIC platform. eASIC also provides easicopy ASIC that provides OEMs with a path from Nextreme-3, Nextreme-2, or Nextreme devices to a cell-based easicopy ASIC, which thereby helps OEMs reduce device cost and power consumption further, or increase performance, and eZ-IP alliance program to bring a wealth of verified eASIC-ready IP cores to help customers get to market faster. Its products are used in various applications that span from wireless infrastructure to consumer handheld devices. eASIC serves customers worldwide. Zvi Or-Bach founded eASIC in 1999, with its headquarters in Santa Clara in California with additional offices worldwide.
NextIO NextIO
NextIO, Inc was an information technology company based in Austin, Texas. Series F
NextIO NextIO
NextIO, Inc was an information technology company based in Austin, Texas. $18.8M / Series C
NextIO NextIO
NextIO, Inc was an information technology company based in Austin, Texas. $10M / Series B

Co-Investors

Decathlon Capital Partners

About Decathlon Capital Partners

VC Fund · Palo Alto, United States

Decathlon Capital Partners provides growth capital for companies seeking alternatives to traditional equity investment. Through the use of highly customized revenue-based financing solutions, Decathlon provides long-term growth capital without the dilution, loss of control and operational overhead that often comes with equity-based funding.

Decathlon Capital Partners Contacts

NameEmailPhoneSocials
Wayne Cantwell
Wayne Cantwell Co-Founder and Managing Director
John Borchers
John Borchers Co-Founder & Managing Director

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FAQ

What does Wayne Cantwell invest in?

Wayne Cantwell invests primarily in Consulting, Electronics and Manufacturing startups, most often at Series C and Funding Round stage. Most of the 10 investments tracked by Shizune back companies in United States. The Investment Focus section breaks down every industry, stage and country in the portfolio.

When did Wayne Cantwell last invest?

The most recent investment recorded for Wayne Cantwell closed in Apr 2023. Shizune tracks 10 investments in total for this profile, including round sizes, stages and portfolio companies, all sourced from confirmed public funding rounds and refreshed monthly.

Is Shizune's investor data accurate?

Yes — every stat on this profile is calculated from confirmed public funding rounds monitored across hundreds of sources since 2020. This profile was last refreshed in Aug 2026 and is updated monthly. Spotted something off? Use the “Suggest an edit” link near the top of the page.

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